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MediaTek · HsinChu

# <Data Center> Advanced Package Engineer/ Technical Manager

HsinChu Manager or lead Data & Analytics 

Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120261002001)

[OpenNash Jobs](https://jobs.opennash.com/) / [MediaTek](https://jobs.opennash.com/companies/mediatek/) / <Data Center> Advanced Package Engineer/ Technical Manager

## Job description

1. CoWoS and 2.5D package technology development 2. 3D package technology development 3. CPC/CPO package technology development 4. Mobile/WiFi/TV/Automotive package development 5. Package technology integration and NTO handle 6. Package design/SIPI/Layout 7. Package Modeling #LI-JK1

## At a glance
- Posted by the employer: Not stated
- First seen by OpenNash: Oct 23, 2026
- Last checked: Oct 23, 2026
- Listed for: Under a day
- Location: HsinChu[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120261002001)

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Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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