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MediaTek · HsinChu

# Technological Sourcing Manager - Packaging (2.5D/3.5D/Panel)

HsinChu Manager or lead 

Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120261006004)

[OpenNash Jobs](https://jobs.opennash.com/) / [MediaTek](https://jobs.opennash.com/companies/mediatek/) / Technological Sourcing Manager - Packaging (2.5D/3.5D/Panel)

## Job description
- Responsible for technology and supply ecosystem planning in Data Center ASIC Packaging (2.5D/3.5D/Panel) domains.
- Develop deep understanding of suppliers' technology capabilities, capacity planning, and roadmap direction to build strategic ecosystem insights.
- Engage with R&D early during product definition and design phases to incorporate supply chain and manufacturing perspectives.
- Ensure product design are aligned with future supplier technology readiness, capacity, and manufacturing capability during design phases.
- Proactively identify technology and supply risks to enable scalable and competitive product solutions during design phases. #LI-JK1

## At a glance
- Posted by the employer: Not stated
- First seen by OpenNash: Oct 23, 2026
- Last checked: Oct 23, 2026
- Listed for: Under a day
- Location: HsinChu[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120261006004)

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Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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