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MediaTek · HsinChu

# Advanced Packaging Principal Engineer (EMIB/2.5D/3D)

HsinChu Senior individual contributor Operations 

Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120260420000)

[OpenNash Jobs](https://jobs.opennash.com/) / [MediaTek](https://jobs.opennash.com/companies/mediatek/) / Advanced Packaging Principal Engineer (EMIB/2.5D/3D)

## Job description

1. 2.5D/3.5D package technology development​ 2. SoC/Memory heterogeneous integration package development​ 3. Package technology integration, NPI and MP​ 4. Project management​

## At a glance
- Posted by the employer: Not stated
- First seen by OpenNash: Oct 23, 2026
- Last checked: Oct 23, 2026
- Listed for: Under a day
- Location: HsinChu[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120260420000)

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