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MediaTek · HsinChu

# 3DIC Advance Package Design Engineer

HsinChu Design 

Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120240515001)

[OpenNash Jobs](https://jobs.opennash.com/) / [MediaTek](https://jobs.opennash.com/companies/mediatek/) / 3DIC Advance Package Design Engineer

## Job description
- Contribute to the development and enhancement of design methodologies for 2.5D and 3D IC advanced package design.
- Lead the development of new design and signoff flows for physical, electrical, and thermal quality assurance.
- Support package design teams in defining a tool roadmap for advanced package design.
- Contribute to interposer designs, advanced package designs, and test vehicles for the product design roadmap and feasibility.
- Represent the Package design team in customer engagements for advanced package designs. #LI-JK1

## At a glance
- Posted by the employer: Not stated
- First seen by OpenNash: Oct 23, 2026
- Last checked: Oct 23, 2026
- Listed for: Under a day
- Location: HsinChu[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120240515001)

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