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MediaTek · HsinChu

# Memory Packaging Technical Manager

HsinChu Manager or lead 

Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120250917000)

[OpenNash Jobs](https://jobs.opennash.com/) / [MediaTek](https://jobs.opennash.com/companies/mediatek/) / Memory Packaging Technical Manager

## Job description

Product 2.5D/3D/3.5D heterogeneous package development, LPDDR/HBM/IPM development for advanced package, product memory roadmap, package memory architecture, customized HBM development #LI-JK1

## At a glance
- Posted by the employer: Not stated
- First seen by OpenNash: Oct 23, 2026
- Last checked: Oct 23, 2026
- Listed for: Under a day
- Location: HsinChu[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120250917000)

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Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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