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MediaTek · HsinChu

# Package and Chip thermal/stress simulation engineer

HsinChu Operations 

Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120250721001)

[OpenNash Jobs](https://jobs.opennash.com/) / [MediaTek](https://jobs.opennash.com/companies/mediatek/) / Package and Chip thermal/stress simulation engineer

## Job description
- Package related structure stress analysis including warpage, material study.
- Package and board level stress modeling for TCT, drop and vibration.
- IC and package thermal analysis, modeling and characterization
- Chip-Package-PCB thermal co-simulation and design.
- System level thermal simulation
- System level stress simulation #LI-JK1

## At a glance
- Posted by the employer: Not stated
- First seen by OpenNash: Oct 23, 2026
- Last checked: Oct 23, 2026
- Listed for: Under a day
- Location: HsinChu[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120250721001)

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