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MediaTek · Singapore

# Engineer/Staff Engineer – Multi-Dies Physical Verification Engineer

Singapore Senior individual contributor Operations 

Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MSL120260227001)

[OpenNash Jobs](https://jobs.opennash.com/) / [MediaTek](https://jobs.opennash.com/companies/mediatek/) / Engineer/Staff Engineer – Multi-Dies Physical Verification Engineer

## Job description

Join the MediaTek Chip Physical Verification team and help create technology for products that will delight and inspire millions of people every day. As a member of our team, you will define and enable physical sign-off flows and solutions for SoC and Multi-Dies (3D IC) design, ensuring first-time success in product tape-out. In this role, you will develop and implement technologies at advanced process nodes, contributing to the success of cutting-edge products.

### Job Responsibilities
- Responsible for Multi-Dies Physical Verification Sign-off in area of (3D_Stack, 3D_PERC, 3D_ANT) for tape-out.
- Co-work with Package Design Team to resolve Multi-Dies integration issues.
- Co-work with ESD Team to run 3D_PERC flow.
- Coordinates with Chip PV Team on active dies related issues (DRC, LVS, ANT, ERC, ESD)
- Provide automation solutions to improve efficiency in tape-out flow.
- Report on Tapeout PV issues. #LI-WC1

## At a glance
- Posted by the employer: Not stated
- First seen by OpenNash: Oct 23, 2026
- Last checked: Oct 23, 2026
- Listed for: Under a day
- Location: Singapore[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MSL120260227001)

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