[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All Intel jobs](https://jobs.opennash.com/companies/intel/) · [Search jobs](/search/) Intel · Us, OR # Process Integration Development Engineer US, Oregon, Hillsboro $133,800.00-188,890.00 Operations Listed on Intel’s official careers site. Posted October 6, 2026. Check that it is still open and apply there. [Apply on Intel’s careers site →](https://intel.wd1.myworkdayjobs.com/External/job/US-Oregon-Hillsboro/Process-Integration-Development-Engineer_JR0287701) [OpenNash Jobs](https://jobs.opennash.com/) / [Intel](https://jobs.opennash.com/companies/intel/) / Process Integration Development Engineer ## Job description ### Job Details Job Description: At Intel, we are at the forefront of innovation, creating world-changing technology that enriches the lives of every person on planet. The Foundry labs directly support advancement of Intel's technology development. The transmission electron microscopy group supports engineering activities in fabrication, failure analysis, technology development, process development, process integration, and pathfinding. Our job is to understand where our manufacturing process and metrologies need to be improved. We are looking for engineers who love solving technical problems, are driven to achieve results, and are flexible in adapting to new methods, tools, and fields of study depending on what is needed to solve the problem at hand. The position will involve characterizing semiconductor nano-devices using advanced transmission electron microscopy (TEM) to expand analytical capabilities. The Time-To-Information-Return (TTIR) of this imaging analysis is critical to TD as we advance process nodes and require revolutionary changes in our support structure and methodologies. We are embarking on those changes. The position is responsible for TEM sample preparation, TEM sample imaging and analysis in high throughput environment. The Engineer will be responsible for but not limited to: - Technical functions in support of engineering activities such as fabrication, failure analysis, technology development, process development, and process integration. - Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. - Conducts engineering tasks and detailed technical procedures to perform sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools in support of the research and development activities of Intel. - Contributes to continuous improvement efforts in high volume manufacturing environments. - Performs other related duties as required or as directed. - Continuous upgrading of skill set; requires an open attitude and skills to learn from. ### Qualifications You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. ### Minimum Qualifications - PhD degree in a Technical Area (Materials Science, Chemistry, Physics or comparable field). - At least 2 years of experience with Transmission Electron Microscopy (TEM) operation. - At least 1 year of experience with Python scripting or MATLAB or other programming languages. ### Preferred qualifications - Hands-on Experience with TEM sample preparation and/or TEM sample imaging with automation. - Hands-on Experience with Advanced Transmission Electron Microscopy, such as EELS, EDX and/or 4D STEM. - Knowledge of electron optics. - Knowledge of semiconductor process integration. ### Job Type Experienced Hire Shift: Shift 1 (United States of America) ### Primary Location US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. - Job posting details (such as work model, location or time type) are subject to change. ### ADDITIONAL INFORMATION - Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. ## At a glance - Posted by the employer: Oct 6, 2026 - First seen by OpenNash: Oct 11, 2026 - Last checked: Oct 18, 2026 - Listed for: 12 days - Location: US, Oregon, Hillsboro - Pay: $133,800.00-188,890.00[Apply on Intel’s careers site →](https://intel.wd1.myworkdayjobs.com/External/job/US-Oregon-Hillsboro/Process-Integration-Development-Engineer_JR0287701) ## More jobs at Intel ### [(Epi) - Module Development Engineer - (PhD Intern)](https://jobs.opennash.com/companies/intel/jobs/cad66e4dea67e7e1942a/) US, Oregon, Hillsboro ### [AMHS Equipment Engineer](https://jobs.opennash.com/companies/intel/jobs/4650e6ae9e5225053472/) US, Oregon, Hillsboro ### [Advanced Packaging Metrology Engineering Manager](https://jobs.opennash.com/companies/intel/jobs/532023bbb8a1d5ab928e/) US, Oregon, Hillsboro ### [Advanced Packaging Module Development Engineer](https://jobs.opennash.com/companies/intel/jobs/a3ef729399b287fc3515/) US, Oregon, Hillsboro ### [Advanced Packaging TD Plating Module Engineer](https://jobs.opennash.com/companies/intel/jobs/52bc6b4020a144e816be/) US, Oregon, Hillsboro ## Similar jobs at other companies ### [Dewar Process Integration Engineer Sr](https://jobs.opennash.com/companies/lockheed-martin/jobs/29802de3ac174f9fa6fd/) Lockheed Martin · Goleta, CA ### [Semiconductor Process Integration Engineer Sr](https://jobs.opennash.com/companies/lockheed-martin/jobs/0a5d4f76ebb271153c2b/) Lockheed Martin · Goleta, CA ### [Senior Process Integration Engineer](https://jobs.opennash.com/companies/macom-technology-solutions-holdings/jobs/5847d253e8afc39f71d2/) MACOM Technology Solutions Holdings · Lowell, MA ### [Sr. Process Development & Integration Engineer](https://jobs.opennash.com/companies/teledyne-technologies/jobs/8b3c9b761799beabb115/) Teledyne Technologies · Goleta, US, CA ### [Senior Engineer, FECOS cPIE Process Integration (Loop Integration)](https://jobs.opennash.com/companies/micron-technology/jobs/e86c99f82142776e0d31/) Micron Technology · Boise [Jobs in Oregon](/locations/us-or/)[Operations jobs](/functions/operations/) OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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