[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All Intel jobs](https://jobs.opennash.com/companies/intel/) · [Search jobs](/search/) Intel · Us, OR # (Epi) - Module Development Engineer - (PhD Intern) US, Oregon, Hillsboro Early career $120,898.00-120,902.00 Operations Listed on Intel’s official careers site. Posted October 7, 2026. Check that it is still open and apply there. [Apply on Intel’s careers site →](https://intel.wd1.myworkdayjobs.com/External/job/US-Oregon-Hillsboro/XMLNAME--Epi----Module-Development-Engineer----PhD-Intern-_JR0287820) [OpenNash Jobs](https://jobs.opennash.com/) / [Intel](https://jobs.opennash.com/companies/intel/) / (Epi) - Module Development Engineer - (PhD Intern) ## Job description ### Job Details Job Description: The Role and Impact As a Module Engineering PhD Intern, you will contribute to the optimization and development of manufacturing processes for a specific module within semiconductor production. Your day-to-day responsibilities will involve sustaining and improving manufacturing equipment, troubleshooting issues, and supporting qualification activities. This hands-on internship offers a unique opportunity to apply your academic knowledge, gain practical skills, and explore career possibilities in a dynamic and innovative environment. Business group Intel Foundry aims to advance semiconductor manufacturing technologies and deliver cutting-edge solutions to meet customer needs globally. As part of this organization, you will join a team dedicated to enhancing manufacturing processes and sustaining high-performance equipment, enabling Intel's broader mission of technological excellence. Working in this collaborative environment offers a chance to contribute to groundbreaking innovations in semiconductor production. ### Key Responsibilities Support the development and implementation of semiconductor manufacturing processes for a specific module. Sustain and improve manufacturing equipment performance to ensure operational reliability and efficiency. Assist in troubleshooting equipment issues and performing qualification activities to meet production standards. Collaborate with engineering teams to enhance process control methodologies and achieve production goals. Apply statistical analysis and design experimental methodologies to improve process reliability and throughput. Gain hands-on experience with materials and device characterization techniques, such as SEM and TEM. Contribute to continuous improvement initiatives for process control systems and methodologies. ### Minimum Qualifications Ph.D. degree in progress in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or another STEM-related field. Knowledge of semiconductor processing fundamentals, including lithography, etching, polishing, and deposition techniques. Familiarity with statistical data analysis and experimental design methodologies. Experience in materials and physical device characterization techniques, such as SEM or TEM, gained through coursework, academic research, or hands-on training. Familiarity with process control techniques and methodologies. ### Preferred Qualifications PhD student 3rd or 4th year; experience with thin film deposition and characterization. Hands-on experience using and maintaining scientific equipment, research experience, experimental and data analysis expertise. Semiconductor device research, development or characterization experience This internship provides a unique opportunity to collaborate, innovate, and gain impactful hands-on experience in semiconductor manufacturing. If you are passionate about advancing technology and exploring meaningful career opportunities, we encourage you to apply today. ### Job Type Student / Intern Shift: Shift 1 (United States of America) ### Primary Location US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process. Work Model for this Role This role will require an on-site presence. - Job posting details (such as work model, location or time type) are subject to change. ### ADDITIONAL INFORMATION - Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. ## At a glance - Posted by the employer: Oct 7, 2026 - First seen by OpenNash: Oct 11, 2026 - Last checked: Oct 18, 2026 - Listed for: 11 days - Location: US, Oregon, Hillsboro - Pay: $120,898.00-120,902.00[Apply on Intel’s careers site →](https://intel.wd1.myworkdayjobs.com/External/job/US-Oregon-Hillsboro/XMLNAME--Epi----Module-Development-Engineer----PhD-Intern-_JR0287820) ## More jobs at Intel ### [AMHS Equipment Engineer](https://jobs.opennash.com/companies/intel/jobs/4650e6ae9e5225053472/) US, Oregon, Hillsboro ### [Advanced Packaging Metrology Engineering Manager](https://jobs.opennash.com/companies/intel/jobs/532023bbb8a1d5ab928e/) US, Oregon, Hillsboro ### [Advanced Packaging Module Development Engineer](https://jobs.opennash.com/companies/intel/jobs/a3ef729399b287fc3515/) US, Oregon, Hillsboro ### [Advanced Packaging TD Plating Module Engineer](https://jobs.opennash.com/companies/intel/jobs/52bc6b4020a144e816be/) US, Oregon, Hillsboro ### [Back End( BE) Process Integration Engineer](https://jobs.opennash.com/companies/intel/jobs/e351e4027e8ba586c75f/) US, Oregon, Hillsboro ## Similar jobs at other companies ### [Automotive Module Product Engineer, Senior](https://jobs.opennash.com/companies/qualcomm/jobs/ff5c6bbc9c9e2643c406/) Qualcomm · Tijuana, Baja California, Mexico ### [Test Engineer II - Digital Module](https://jobs.opennash.com/companies/bae-systems/jobs/0177e627f761ac5192c4/) BAE Systems · Fort Wayne, Indiana, United States ### [Module Advanced Development Signal Integrity Engineer](https://jobs.opennash.com/companies/nokia/jobs/a759ac86682fbcdc35c2/) Nokia · United States ### [Software Development Engineer, Amazon Leo for Government - Leo Modem Module Software Team](https://jobs.opennash.com/companies/amazon/jobs/75ec64f57729a921a05c/) Amazon · US, WA, Redmond ### [Development Engineer II - Connectivity Module HW](https://jobs.opennash.com/companies/lg-electronics/jobs/6c75a7fdbf43cba43d04/) LG Electronics · Troy OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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