[Skip to main content](#main-content) [ OpenNash ](https://opennash.com/) / [Jobs](https://jobs.opennash.com/) [ 01 Search jobs](https://jobs.opennash.com/search/)[ 02 Companies](https://jobs.opennash.com/explore/)[ 03 Hiring report](https://jobs.opennash.com/reports/hiring/)[ 04 AI assistants](https://jobs.opennash.com/connect/)[ 05 How it works](https://jobs.opennash.com/methodology/) Intel · Us, OR # Thin Films Module Engineering - PhD Intern US, Oregon, Hillsboro Early career $120,898.00-120,902.00 Operations Listed on Intel’s official careers site. Posted October 21, 2026. Check that it is still open and apply there. [Apply on Intel’s careers site →](https://intel.wd1.myworkdayjobs.com/External/job/US-Oregon-Hillsboro/Thin-Films-Module-Engineering---PhD-Intern_JR0288074) [OpenNash Jobs](https://jobs.opennash.com/) / [Intel](https://jobs.opennash.com/companies/intel/) / Thin Films Module Engineering - PhD Intern ## Job description ### Job Details Job Description: The Role and Impact As a Module Engineering PhD Intern, you will play a key role in developing and sustaining semiconductor manufacturing processes for a specific module. Your day-to-day responsibilities will include supporting equipment troubleshooting, performing maintenance and qualification activities, and collaborating with engineering teams to optimize process control methodologies. This role offers a unique opportunity to gain hands-on experience in semiconductor manufacturing while building essential skills for a future career in engineering. Business group You will join the Intel Foundry team, a dynamic and innovative group dedicated to delivering cutting-edge manufacturing solutions that drive Intel's technology forward. The team focuses on advancing semiconductor fabrication processes in areas such as Diffusion, Dielectrics, Implant, EPI, and FE Metals. As part of this group, you will contribute to Intel's mission of creating world-changing technology that enables global progress and enriches lives. What We Do As members of the Manufacturing Development and Customer Engineering (MDCE) team, we are responsible for improving process capability for multiple technology nodes (Intel 18A, Intel 3, Intel 12nm and upcoming technologies) from initial product qualification through high volume manufacturing. The focus will be on delivering yield improvement, performance enhancement, variation and cost reduction. ### Key Responsibilities Assist with the development and implementation of thin film manufacturing processes for a specific module within Intel's semiconductor production. Support troubleshooting and maintenance activities for manufacturing equipment to ensure optimal performance. Participate in equipment qualification processes, ensuring compliance with quality and functional standards. Collaborate with engineering teams to optimize process control methodologies and achieve production targets. Establish strong working relationships and partner closely with technology development, high volume manufacturing and cross-functional stakeholders to achieve common goals. Analyze data trends, identify solutions for process improvement and drive automation improvements (using AI where applicable) Contribute to sustaining and improving manufacturing tools and processes while gaining hands-on experience in semiconductor engineering. ### Minimum Qualifications Currently pursuing a PhD degree in a relevant STEM discipline (e.g. Physics, Applied Chemistry, Chemical Engineering, Electronic Engineering, Mechanical Engineering, Computer Science, etc.). Strong analytical and problem-solving skills. Experience writing software code for application in above majors Excellent communication skills - both written and verbal. Ability to work independently and as part of a diverse, high-performing team. Willingness to work in a cleanroom environment. Strong attention to detail and disciplined approach to procedures. Data analysis skills with demonstrated ability to construct clear data-based problem statements, design of experiment. ### Preferred Qualifications Experience with data analysis tools and software (e.g. JMP, Python, Excel, and AI tools). Ability to summarize data for technical and non-technical audiences. Please note, the ideal candidate will be open to work a 6-month internship schedule beginning the Spring of 2027 through December 2027. This is your chance to join a global leader in semiconductor manufacturing, gain real-world experience, and contribute to innovative solutions that shape the future of technology. If you are ready to learn, grow, and make an impact, we encourage you to apply today. ### Job Type Student / Intern Shift: Shift 1 (United States of America) ### Primary Location US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process. Work Model for this Role This role will require an on-site presence. - Job posting details (such as work model, location or time type) are subject to change. ### ADDITIONAL INFORMATION - Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. ## At a glance - Posted by the employer: Oct 21, 2026 - First seen by OpenNash: Oct 25, 2026 - Last checked: Nov 1, 2026 - Listed for: 11 days - Location: US, Oregon, Hillsboro - Pay: $120,898.00-120,902.00[Apply on Intel’s careers site →](https://intel.wd1.myworkdayjobs.com/External/job/US-Oregon-Hillsboro/Thin-Films-Module-Engineering---PhD-Intern_JR0288074) ## Hiring at Intel - Open jobs: 801 - New in the last 7 days: After two weekly collections - Tracked since: Jul 10, 2026 [All Intel jobs](https://jobs.opennash.com/companies/intel/) · [Weekly hiring report](/reports/hiring/) ## More jobs at Intel ### [(Epi) - Module Development Engineer - (PhD Intern)](https://jobs.opennash.com/companies/intel/jobs/cad66e4dea67e7e1942a/) US, Oregon, Hillsboro ### [AMHS Equipment Engineer](https://jobs.opennash.com/companies/intel/jobs/4650e6ae9e5225053472/) US, Oregon, Hillsboro ### [Advanced Packaging Module Development Engineer](https://jobs.opennash.com/companies/intel/jobs/a3ef729399b287fc3515/) US, Oregon, Hillsboro ### [Advanced Packaging TD Plating Module Engineer](https://jobs.opennash.com/companies/intel/jobs/52bc6b4020a144e816be/) US, Oregon, Hillsboro ### [CAD/EDA Tools Automation Engineer](https://jobs.opennash.com/companies/intel/jobs/1f00c7b03e4ef0e37a84/) US, Oregon, Hillsboro ## Similar jobs at other companies ### [Senior Thin Films Module Engineer](https://jobs.opennash.com/companies/on-semiconductor/jobs/6b909b56e98d197739b7/) ON Semiconductor · Hopewell Junction, NY, United States ### [Shift Thin Films Module Engineer](https://jobs.opennash.com/companies/on-semiconductor/jobs/9f3fa2fad2a5f8023867/) ON Semiconductor · Hopewell Junction, NY, United States ### [Thin Films Technician](https://jobs.opennash.com/companies/teledyne-technologies/jobs/8107f29c96b7cdc02091/) Teledyne Technologies · Camarillo, US, CA ### [Staff Semiconductor Thin Films Process Engineer, Raxium](https://jobs.opennash.com/companies/alphabet/jobs/ccb2a5d21a299d0d43c5/) Alphabet · Fremont, CA, USA ### [Senior Engineer Equipment - CVD/Thin Films](https://jobs.opennash.com/companies/analog-devices/jobs/c3a46e2a0299f6f4f7c6/) Analog Devices · US, WA, Camas OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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