[Skip to main content](#main-content) [ OpenNash ](https://opennash.com/) / [Jobs](https://jobs.opennash.com/) [ 01 Search jobs](https://jobs.opennash.com/search/)[ 02 Companies](https://jobs.opennash.com/explore/)[ 03 Hiring report](https://jobs.opennash.com/reports/hiring/)[ 04 AI assistants](https://jobs.opennash.com/connect/)[ 05 How it works](https://jobs.opennash.com/methodology/) Intel · Malaysia, Kulim # TEG Engineer Malaysia, Kulim Full-time Operations Listed on Intel’s official careers site. Posted October 29, 2026. Check that it is still open and apply there. [Apply on Intel’s careers site →](https://intel.wd1.myworkdayjobs.com/External/job/Malaysia-Kulim/TEG-Engineer_JR0288705) [OpenNash Jobs](https://jobs.opennash.com/) / [Intel](https://jobs.opennash.com/companies/intel/) / TEG Engineer ## Job description ### Job Details Job Description: The Role and Impact As a Module Engineer, you will play a critical role in optimizing high-volume manufacturing equipment and processes to enable the production of cutting-edge integrated circuits. Your daily responsibilities will involve conducting tests and measurements to ensure control over critical dimensions and defectivity, recommending process modifications to enhance efficiency and quality, and ensuring seamless technology transfer across global manufacturing sites. This position offers the opportunity to make a direct impact on Intel's semiconductor manufacturing leadership while fostering technical growth in a dynamic, innovative environment. This is an onsite manufacturing role supporting a 24/7 factory environment. The position requires working on a rotating shift schedule, including day and night shifts, with weekly shift rotations to support continuous manufacturing operations and business needs. Business Group This role is part of Intel's Assembly and Test Manufacturing (ATM) organization, a key component of Intel's back-end manufacturing ecosystem. ATM supports Intel's diverse product portfolio, including client, automotive, server, and connectivity segments. The team focuses on delivering advanced packaging and testing solutions while driving manufacturing excellence and supporting global technology initiatives, aligning with Intel's IDM 2.0 strategy. ### Key Responsibilities Own and optimize high-volume manufacturing equipment and processes to achieve production efficiency, quality, and cost targets. Conduct tests and measurements to control critical dimensions and reduce defectivity in manufacturing lines. Recommend and implement modifications for operational improvements, including safety, productivity, and output performance. Build high-volume manufacturing capacity while ensuring seamless technology transfer across global sites. Execute maintenance, repair, and continuous improvement initiatives for equipment and processes to meet key performance metrics (e.g., safety, quality, productivity, and yield). Develop systems to prevent process excursions and identify discrepant materials or activities affecting equipment and processes. Manage equipment installation, conversion, and qualification during factory ramps, ensuring safe operations and adherence to quality standards. Collaborate with cross-functional teams and external suppliers to optimize processes aligned with high-volume production requirements. Facilitate technology transfers through training, audits, and ensuring process consistency across global manufacturing sites. ### Minimum Qualifications Bachelor's degree in Mechanical, Electrical, or Chemical Engineering, or any relevant engineering degree with 1-3 years of hands-on experience gained through internships, academic projects, coursework, or training. OR Master's degree in a relevant field with no prior professional experience.Proficiency in statistical process control (SPC) and data-driven problem-solving methods. Technical expertise in mechanical design, electrical circuitry, and software tools such as JMP or SQL Pathfinder. Experience in equipment management, maintenance, and improvement processes. Ability to work effectively in cleanroom environments with proper PPE. ### Preferred Qualifications Familiarity with semiconductor manufacturing equipment and processes. Must have a deep knowledge in machine/equipment systemic troubleshooting with data analyzation. Knowledge of design of experiments (DOE) principles and failure modes/effects analysis (FMEA). Strong analytical skills and troubleshooting capabilities. Experience with Power BI, SQL Pathfinder, or relevant scripting tools to drive analytics and optimization. Adaptability to handle multiple tasks and adjust to dynamic operational priorities. Demonstrated ability to work independently and collaboratively across teams to drive initiatives. Join Intel's team and contribute your expertise to shaping the future of semiconductor manufacturing processes. Unlock opportunities to grow your career while driving innovation and excellence in a dynamic and forward-thinking environment. ### Job Type Experienced Hire Shift: Shift 1 (Malaysia) ### Primary Location Malaysia, Kulim Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will require an on-site presence. - Job posting details (such as work model, location or time type) are subject to change. ### ADDITIONAL INFORMATION - Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. ## At a glance - Posted by the employer: Oct 29, 2026 - First seen by OpenNash: Nov 1, 2026 - Last checked: Nov 1, 2026 - Listed for: 3 days - Location: Malaysia, Kulim - Employment type: Full-time[Apply on Intel’s careers site →](https://intel.wd1.myworkdayjobs.com/External/job/Malaysia-Kulim/TEG-Engineer_JR0288705) ## Hiring at Intel - Open jobs: 801 - New in the last 7 days: After two weekly collections - Tracked since: Jul 10, 2026 [All Intel jobs](https://jobs.opennash.com/companies/intel/) · [Weekly hiring report](/reports/hiring/) ## More jobs at Intel ### [CUF TD Module Engineer](https://jobs.opennash.com/companies/intel/jobs/d1c511f0db3424bf5416/) Malaysia, Kulim ### [Construction and Tool Install Project Manager (Contract)](https://jobs.opennash.com/companies/intel/jobs/061940f8d97067cc467e/) Malaysia, Kulim ### [Die Prep Module Engineer (Contract Role)](https://jobs.opennash.com/companies/intel/jobs/ef5a99694f0da843c0ae/) Malaysia, Kulim ### [NPI Engineer](https://jobs.opennash.com/companies/intel/jobs/e8988bde851c7c0c22df/) Malaysia, Kulim ### [Packaging Module Development Engineer](https://jobs.opennash.com/companies/intel/jobs/e3cf2ac3df41db87543c/) Malaysia, Kulim ## Similar jobs at other companies ### [Professionals TEG_ENG](https://jobs.opennash.com/companies/tdk/jobs/36a2f1c3a9c6236d7ec0/) TDK ### [Test Engineer – HSIO ATE Test Development & Characterization, Engineer to Senior Engineer](https://jobs.opennash.com/companies/qualcomm/jobs/cf40c94f18d6c1f73b5f/) Qualcomm · Hsinchu City, Taiwan ### [【Welcome New Grads】Package/System Design Solutions Engineer - Engineer / Sr. Engineer](https://jobs.opennash.com/companies/qualcomm/jobs/f9102030826588db58c4/) Qualcomm · Hsinchu City, Taiwan ### [Cybersecurity Engineer / Implementation Engineer](https://jobs.opennash.com/companies/ntt/jobs/6921fbe7f6a8a6c35ff5/) NTT · Singapore OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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