[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All IBM jobs](https://jobs.opennash.com/companies/ibm/) · [Search jobs](/search/) IBM · Yorktown Heights, NY # Research Scientist – RF/Mixed-Signal Packaging and Module Design Yorktown Heights, NY Design Listed on IBM’s official careers site. Posted August 21, 2026. Check that it is still open and apply there. [Apply on IBM’s careers site →](https://ibm.dejobs.org/jobs/8A09DF787AAA4239A6B1856E3FBFF8EE/) [OpenNash Jobs](https://jobs.opennash.com/) / [IBM](https://jobs.opennash.com/companies/ibm/) / Research Scientist – RF/Mixed-Signal Packaging and Module Design ## Job description ### Introduction At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud. You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world. ### Your role and responsibilities IBM Quantum is hiring a Research Scientist to contribute to the development of advanced, high-performance RF and mixed-signal single-chip and multi-chip modules (MCMs) for exploratory applications. We focus on differentiated solutions for a range of communication and computation challenges, including the creation of CMOS-based electronics for quantum computing applications. Successful applicants will have demonstrated experience in the development of complex packaging solutions for RF and mixed-signal functions. In this role, you may be tasked with designing packages that support RFICs, high-speed digital interfaces, and high-density interconnects. Various substrate technologies can be used for these designs including organic laminates and Si-based interposers. The design process will include EM simulation, package-IC co-simulation, and signal integrity and power integrity analysis (SI/PI). You will work in close collaboration with IC and system designers and be involved in all aspects of design projects from concept and module architecture exploration/definition to bring up and test; demonstrated hands-on lab skills are therefore important. In addition, background in communication theory and systems and/or quantum computing would be advantageous. ### Required technical and professional expertise Strong background in RF/microwave engineering. Familiarity with state-of-the art packaging technologies. Experience with HFSS, ADS, Cadence Allegro, or similar tools. ### RF/Mixed-Signal Package Design A strong foundation and experience in package physical design, EM simulation, and SI/PI. (2 years). ### Module implementation Demonstrated expertise through successful implementation of RF, analog, and/or mixed-signal packaging solutions including experimental characterization (2 years). ### Preferred technical and professional experience Experience with packaging solution design involving high-density digital interconnects RF and/or digital IC design experience is a plus Programming Skills: Candidates with strong programming skills in commonly used languages Communication and collaboration skills: Excellent verbal and written communication skills are highly valued for effective collaboration within the team. A track record of successful participation in multi-disciplinary research and development projects is a plus. ### Research skills Proven record of research accomplishment (e.g. publications) IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status. ## At a glance - Posted by the employer: Aug 21, 2026 - First seen by OpenNash: Oct 19, 2026 - Last checked: Oct 19, 2026 - Listed for: 59 days - Location: Yorktown Heights, NY[Apply on IBM’s careers site →](https://ibm.dejobs.org/jobs/8A09DF787AAA4239A6B1856E3FBFF8EE/) ## More jobs at IBM ### [Design Engineer Intern 2027 - Design and Build AI-Native Interfaces](https://jobs.opennash.com/companies/ibm/jobs/1d8d2fa5adbca7386e95/) Yorktown Heights, NY ### [Design Intern 2027 - Advanced Integrated Circuits Research](https://jobs.opennash.com/companies/ibm/jobs/d14e2ba8e33d8867e731/) Yorktown Heights, NY ### [Mechanical Designer](https://jobs.opennash.com/companies/ibm/jobs/b370eb1fbbfb6596c17f/) Yorktown Heights, NY ### [Product Designer Intern - 2027](https://jobs.opennash.com/companies/ibm/jobs/b305b05170867bc86146/) Yorktown Heights, NY ### [Quantum Hardware EDA & Circuit Design Intern - 2027](https://jobs.opennash.com/companies/ibm/jobs/5058e93832078bd0fc6b/) Yorktown Heights, NY ## Similar jobs at other companies ### [RGP - Advanced Mixed Signal Modeling Engineer](https://jobs.opennash.com/companies/infineon-technologies/jobs/602631ed6ee19858228b/) Infineon Technologies · Andover, MA ### [Program Analyst – Mixed Signal IP](https://jobs.opennash.com/companies/qualcomm/jobs/721b03e483355118c553/) Qualcomm · San Diego, California, United States of America ### [Senior Staff Engineer, Analog Mixed Signal Design](https://jobs.opennash.com/companies/infineon-technologies/jobs/5bcb6b66b7e1a74b1acf/) Infineon Technologies · Irvine, CA ### [Analog/Mixed Signal ASIC Design Engineer](https://jobs.opennash.com/companies/qualcomm/jobs/798ef1101649c25b5f1d/) Qualcomm · San Diego, California, United States of America ### [Senior Electrical Engineer, Mixed-Signal Hardware](https://jobs.opennash.com/companies/ge-healthcare-technologies/jobs/a175462a756dbd1b6bf4/) GE HealthCare Technologies · Waukesha, Wisconsin, United States of America OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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