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IBM · Poughkeepsie, NY

# Entry Level Systems Thermal Modeler 2027 -Poughkeepsie, NY

Poughkeepsie, NY 

Listed on IBM’s official careers site. Posted October 22, 2026. Check that it is still open and apply there.
[Apply on IBM’s careers site →](https://ibm.dejobs.org/jobs/5D6B5B5192404785AA8AF9BCBC9ECB88/)

[OpenNash Jobs](https://jobs.opennash.com/) / [IBM](https://jobs.opennash.com/companies/ibm/) / Entry Level Systems Thermal Modeler 2027 -Poughkeepsie, NY

## Job description

### Introduction

IBM Hardware and Systems engineers design and deliver the compute platforms that power the world’s most advanced AI, cloud, and enterprise technologies. From silicon to system, our teams collaborate across mechanical, electrical, computer, materials, and firmware engineering to design, prototype, and test next-generation IBM hardware. These roles offer hands-on opportunities to innovate across IBM’s high-performance systems portfolio — shaping the technologies that define what’s next.

### Your role and responsibilities

As part of IBM’s hardware development organization, you will design, prototype, and validate next-generation compute systems by integrating expertise across mechanical, electrical, firmware, and materials engineering.

Your work may include:
- Developing and optimizing mechanical, thermal, and electrical components using CAD and CFD tools.
- Building and testing hardware prototypes, performing debug, failure analysis, and driving reliability and serviceability improvements.
- Modeling system-level thermal performance to enhance cooling, manufacturability, and efficiency.
- Applying design-of-experiments (DOE) methods to evaluate and improve processes, materials, and hardware designs.
- Supporting process and materials development, manufacturing readiness, and equipment IT integration within R&D environments. You will have opportunities to work in areas such as:
- Thermal and mechanical modeling for air and liquid cooled systems. Required technical and professional expertise
- M.S. or advanced degree in Mechanical Engineering or Thermal Fluid Science.
- Experience with design of experiments (DOE) and/or project management.
- Hands-on experience with hardware design, CAD tools (SolidWorks, Allegro, Cadence or equivalent), and modeling/simulation environments (Cadence Celsius, Ansys Fluent, Icepak, Flotherm, or equivalent).
- Strong analytical and communication skills, with a focus on collaboration and data-driven problem solving. Preferred technical and professional experience
- Lab-based development or validation work skills.
- Advanced technical degrees (M.S. or Ph.D.) in relevant disciplines.
- Experience leading project teams or cross-functional technical initiatives.
- Proficiency with SolidWorks and/or finite element modeling (FEM) tools. IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.

## At a glance
- Posted by the employer: Oct 22, 2026
- First seen by OpenNash: Oct 26, 2026
- Last checked: Nov 2, 2026
- Listed for: 11 days
- Location: Poughkeepsie, NY[Apply on IBM’s careers site →](https://ibm.dejobs.org/jobs/5D6B5B5192404785AA8AF9BCBC9ECB88/)

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