[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All IBM jobs](https://jobs.opennash.com/companies/ibm/) · [Search jobs](/search/) IBM · Yorktown Heights, NY # Hardware intern 2027: advanced packaging Yorktown Heights, NY Early career Listed on IBM’s official careers site. Posted September 25, 2026. Check that it is still open and apply there. [Apply on IBM’s careers site →](https://ibm.dejobs.org/jobs/189207A13B974EB4A7FEF79F9078F731/) [OpenNash Jobs](https://jobs.opennash.com/) / [IBM](https://jobs.opennash.com/companies/ibm/) / Hardware intern 2027: advanced packaging ## Job description ### Introduction At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud. You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world. ### Your role and responsibilities You will be using laser assisted bonding (LAB) and laser assisted reflow (LAR) to explore new advanced soldering techniques. Furthermore, you will be testing the solder constellations in different package variations for warpage, solder joint quality and solder bonding strength. Tests will be run over a very wide temperature range. ### Required technical and professional expertise Candidate for this role is required to have the following expertise: - Studies in EE, Physics,Mechanical Engineering, or a related discipline. - Proficient in SMT assembly processes. - PCB and/or laminate design and stackups. - Efficient definition of experiments and their evaluation. - Openess and interest to do something innovative new with new tools. ### Preferred technical and professional experience Candidate for this role would also benefits from the following expertise: - Advanced studies in EE, physics and mechanical engineering. - Deep knowledge of SMT assembly processes. - Laser soldering experience. - Detailed knowledge of soldering alloys. - Modelling knowledge for mechanical warpage and in=package stress. IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status. ## At a glance - Posted by the employer: Sep 25, 2026 - First seen by OpenNash: Oct 19, 2026 - Last checked: Oct 19, 2026 - Listed for: 24 days - Location: Yorktown Heights, NY[Apply on IBM’s careers site →](https://ibm.dejobs.org/jobs/189207A13B974EB4A7FEF79F9078F731/) ## More jobs at IBM ### [Hardware Intern 2027: Advanced Solder Processes](https://jobs.opennash.com/companies/ibm/jobs/31449981a3828be5c2ea/) Yorktown Heights, NY ### [Quantum Algorithms Theory Intern 2027](https://jobs.opennash.com/companies/ibm/jobs/a531e94f69d7b976e3eb/) Yorktown Heights, NY ### [Quantum Coherence Experimentalist](https://jobs.opennash.com/companies/ibm/jobs/659c1278300b15c546be/) Yorktown Heights, NY ### [Quantum Error Correction Theorist](https://jobs.opennash.com/companies/ibm/jobs/8386364d3d6f2cd4cf8d/) Yorktown Heights, NY ### [Quantum Error Correction Theory Intern - 2027](https://jobs.opennash.com/companies/ibm/jobs/012f5895613028d98266/) Yorktown Heights, NY ## Similar jobs at other companies ### [ElectroMechanical Packaging Engineer (Hardware Protection Focus)](https://jobs.opennash.com/companies/lockheed-martin/jobs/fec793df5b85f784d17f/) Lockheed Martin · Orlando, FL ### [Key Account Technologist (Advanced Packaging)](https://jobs.opennash.com/companies/thermo-fisher-scientific/jobs/6e2e3051ca64c8b385da/) Thermo Fisher Scientific · Hillsboro, Oregon, United States of America ### [ElectroMechanical Packaging Engineer (Hardware Protection Focus)](https://jobs.opennash.com/companies/lockheed-martin/jobs/e97873e6f6f3b3828bb8/) Lockheed Martin · Orlando, FL, Grand Prairie, TX ### [Staff Failure Analysis Engineer - Advanced Packaging Technologies](https://jobs.opennash.com/companies/qualcomm/jobs/6fa0c03a4c53ab7bddea/) Qualcomm · San Diego, California, United States of America ### [Capital Equipment Hardware engineer - Advanced Packaging](https://jobs.opennash.com/companies/applied-materials/jobs/6600bd5ee5e465b6eac7/) Applied Materials · Santa Clara, CA OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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