[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All GlobalFoundries jobs](https://jobs.opennash.com/companies/globalfoundries/) · [Search jobs](/search/) GlobalFoundries # Principal 3D-heterogeneous integration engineer Essex Junction, Vermont, United States of America, Malta, New York Senior individual contributor $85,000.00 - $146,000.00 Operations Listed on GlobalFoundries’s official careers site. Posted September 10, 2026. Check that it is still open and apply there. [Apply on GlobalFoundries’s careers site →](https://careers.gf.com/careers/job/563980770670197) [OpenNash Jobs](https://jobs.opennash.com/) / [GlobalFoundries](https://jobs.opennash.com/companies/globalfoundries/) / Principal 3D-heterogeneous integration engineer ## Job description ### About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. ### Summary of Role GlobalFoundries is seeking an experienced and dedicated R&D engineer, joining Advanced Packaging Lab (APL) to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives spanning multiple application domains. ### Essential Responsibilities - Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g., multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.). - Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs. - Collaborate joint development projects (JDP) with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes. - Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs. - Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources. - Drive data analysis, interpretation of results, and understanding of failure modes. - Identify and resolve process integration issues and related challenges. - Generate IP related to novel wafer integration and packaging technology. ### Other Responsibilities - Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. - Participate in hiring activities. - Mentor and guide new hires to assume their roles and responsibilities. - Other duties as assigned by manager. ### Education - Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. - MS degree with at least 4~5 years of prior related work experience. - In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly. - Strong problem solving and technical trouble shooting skills including expertise in design of experiment. - Must have at least an overall 3.0 GPA and proven good academic standing. - Language Fluency - English (Written & Verbal). - Travel - Up to 10%. ### Education - PhD education level preferred with at least 2~3 years of prior related work experience. - Demonstrated prior leadership experience internally or with an OSAT eco-system. - Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. - Strong written and verbal communication skills. - Strong planning and organizational skills. Expected Salary Range $85,000.00 - $146,000.00 The exact Salary will be determined based on qualifications, experience and location. If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address. An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations. GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory. All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law ## At a glance - Posted by the employer: Sep 10, 2026 - First seen by OpenNash: Oct 13, 2026 - Last checked: Oct 20, 2026 - Listed for: 40 days - Location: Essex Junction, Vermont, United States of America, Malta, New York - Pay: $85,000.00 - $146,000.00[Apply on GlobalFoundries’s careers site →](https://careers.gf.com/careers/job/563980770670197) ## More jobs at GlobalFoundries ### [Quantum 3DHI Engineer (2027 New College Graduate)](https://jobs.opennash.com/companies/globalfoundries/jobs/655bcf53aa24a6132974/) Essex Junction, Vermont, United States of America, Malta, New York ### [Director PostFab Engineering](https://jobs.opennash.com/companies/globalfoundries/jobs/609435d6e0c76af3743b/) Essex Junction, Vermont, United States of America, Malta, New York ### [3D Heterogeneous Integration Engineer (2026 New College Graduate)](https://jobs.opennash.com/companies/globalfoundries/jobs/187d997f1932dc686ade/) Malta, New York, United States of America ### [AI/ML Systems Engineer (2027 New College Graduate)](https://jobs.opennash.com/companies/globalfoundries/jobs/275aabb7d21dae3ca779/) Richardson, TX, US ### [AI/ML Systems Engineering Intern (Summer 2027)](https://jobs.opennash.com/companies/globalfoundries/jobs/43163aa7604dcf38b809/) Richardson, TX, US ## Similar jobs at other companies ### [Process Engineer – Semiconductor Heterogeneous Integration](https://jobs.opennash.com/companies/keysight-technologies/jobs/c371379a2055ecf1cd04/) Keysight Technologies · Santa Rosa, California ### [Senior Principal Systems Engineer - Integration & Test Lead](https://jobs.opennash.com/companies/bae-systems/jobs/d39ed849c9fa84c7ee6b/) BAE Systems · Hudson, New Hampshire, United States ### [Principal Heterogeneous Systems Architect (Board Level Design)](https://jobs.opennash.com/companies/emerson-electric/jobs/4c4b012b60efde9cd832/) Emerson Electric · Austin, TX, United States ### [Software Integration and Test Engineer / Principal Software Integration and Test Engineer (Top Secret Clearance)](https://jobs.opennash.com/companies/northrop-grumman/jobs/0fdb843922d2a4ca8a1b/) Northrop Grumman · United States-California-Manhattan Beach ### [Principal / Sr. Principal Systems Engineer - Integration & Test](https://jobs.opennash.com/companies/northrop-grumman/jobs/8cc6e5b2c14adf4f2824/) Northrop Grumman · United States-Maryland-Baltimore OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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