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China Telecom · 合肥市

# 微组装工艺工程师

合肥市 

Listed on China Telecom’s official careers site. Posted August 25, 2026. Check that it is still open and apply there.
[Apply on China Telecom’s careers site →](https://job.chinatelecom.com.cn/wt/TELE/web/index/webPosition210!getOnePosition?postId=138858&recruitType=1&brandCode=1&columnId=1)

[OpenNash Jobs](https://jobs.opennash.com/) / [China Telecom](https://jobs.opennash.com/companies/china-telecom/) / 微组装工艺工程师

## Job description

### 工艺开发与优化
- 负责光电器件的制造工艺开发，包括共晶、贴片、键合、封焊等关键工艺的设计与优化，提升器件性能及良率；

### 封装流程管控
- 主导工艺导入及流程搭建，制定标准化作业指导书（SOP），监控生产关键参数，解决工艺波动问题，确保封装稳定性和一致性；

### 设备管理
- 负责工艺设备的选型、调试、维护及工艺参数校准，提升设备利用率，降低故障率；

### 跨部门协作
- 与设计、测试、封装团队紧密合作，参与新产品开发（NPI）全流程，提供工艺可行性评估及技术解决方案；

### 技术文档编写
- 撰写工艺规范、实验报告及技术专利等。

### Requirements
- 硕士及以上学历，并取得相应学位，微电子、光电信息科学与工程、材料科学、半导体物理等相关专业；
- 熟悉III-V族化合物半导体（如GaAs、InP）或硅基光电子工艺者优先；
- 精通共晶、贴片、键合、封焊等关键封装工艺，熟悉常用测试设备（探针台、示波器、网络分析仪等）；
- 诚实守信、作风踏实严谨、责任心强，具备良好团队协作能力精神，学习能力强，善于解决复杂问题。

## At a glance
- Posted by the employer: Aug 25, 2026
- First seen by OpenNash: Oct 11, 2026
- Last checked: Oct 18, 2026
- Listed for: 54 days
- Location: 合肥市[Apply on China Telecom’s careers site →](https://job.chinatelecom.com.cn/wt/TELE/web/index/webPosition210!getOnePosition?postId=138858&recruitType=1&brandCode=1&columnId=1)

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Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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