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Capgemini · Bangalore

# Physical Design Solution Architect

Bangalore Design 

Listed on Capgemini’s official careers site. Listed as of October 18, 2026. Check that it is still open and apply there.
[Apply on Capgemini’s careers site →](https://www.capgemini.com/jobs/518671-en_GB+sap_btp)

[OpenNash Jobs](https://jobs.opennash.com/) / [Capgemini](https://jobs.opennash.com/companies/capgemini/) / Physical Design Solution Architect

## Job description

Job DescriptionChoosing Capgemini means choosing a place where you’ll be empowered to shape your career, supported by a collaborative global community, and inspired to reimagine what’s possible. Join us for unlocking the value of technology and drive scalable, sustainable growth.Your RoleOwn physical implementation solutioning, methodology definition, PPA strategy, and implementation planning for complex SoCs. Serve as technical authority for physical design architecture and feasibility.
- Define implementation methodologies for large chips.
- Develop floorplanning and partitioning strategies for SoC Level.
- Drive PPA closure approach from Spec to GDS-II.
- Conduct early feasibility and QoR assessments.
- Define clocking, power, and congestion strategies.
- Guide implementation teams globally.
- TSMC Tech Node experience is must
- Experience on AI based EDA tools is required e.g. DSO or Cerberus etc.
- Review signoff readiness and implementation risks.
- Support customer technical engagements and project estimation.Your Profile
- 12+ years in Physical Design.
- Multiple tape-outs in advanced nodes (10nm and below).
- Expertise in floorplanning, CTS, timing closure, and power optimization.
- Strong knowledge of Synopsys ICC2/Fusion Compiler and/or Cadence Innovus.
- Experience with UPF and multi-voltage designs.
- Experience with large SoCs (>100M gates).
- Strong understanding of signoff methodologies.
- Should be able to support and delivery multiple projects simultaneously.
- HBM/HMC memory systemsGood to Have
- 5nm/3nm implementation experience.
- Chiplet-based floorplanning.
- 3DIC/Advanced packaging.
- HBM integration experience.
- Automotive or HPC silicon experience.What You’ll Love

About Working HereWe value flexibility and support our employees with remote work options and adaptable schedules to maintain a healthy work-life balance.Our inclusive culture brings together diverse professionals committed to growth, innovation, and excellence.You’ll have access to continuous learning opportunities and certifications in emerging technologies like cloud and AI.About UsAt Capgemini Engineering, the world leader in engineering services, we bring together a global team of engineers, scientists, and architects to help the world’s most innovative companies unleash their potential.

From autonomous cars to life-saving robots, our digital and software technology experts think outside the box as they provide unique R&D and engineering services across all industries. Join us for a career full of opportunities. Where you can make a difference. Where no two days are the same. Capgemini is a global business and technology transformation partner, helping organizations accelerate their dual transformation to address the evolving needs of customers and citizens.

With a strong 55-year heritage and deep industry expertise, Capgemini is trusted by its clients to address the entire breadth of their business needs—from strategy and design to operations. To achieve this, Capgemini draws on the capabilities of its 360,000 team members in more than 50 countries, all driven by the purpose of unleashing human energy through technology for an inclusive and sustainable future. It is a responsible and diverse organization with market-leading capabilities in digital, cloud, and data.

## At a glance
- Posted by the employer: Not stated
- First seen by OpenNash: Oct 11, 2026
- Last checked: Oct 18, 2026
- Listed for: 7 days
- Location: Bangalore[Apply on Capgemini’s careers site →](https://www.capgemini.com/jobs/518671-en_GB+sap_btp)

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