[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All Cadence Design jobs](https://jobs.opennash.com/companies/cadence-design/) · [Search jobs](/search/) Cadence Design · Hyderabad # Principal Design Engineer Hyderabad Senior individual contributor Design Listed on Cadence Design’s official careers site. Listed as of October 18, 2026. Check that it is still open and apply there. [Apply on Cadence Design’s careers site →](https://cadence.wd1.myworkdayjobs.com/External_Careers/job/HYDERABAD/Principal-Design-Engineer_R53736) [OpenNash Jobs](https://jobs.opennash.com/) / [Cadence Design](https://jobs.opennash.com/companies/cadence-design/) / Principal Design Engineer ## Job description At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. ### Role Summary We are looking for an experienced Principal Analog Design Engineer to drive the design and delivery of high‑speed interface IPs, with a strong emphasis on Die‑to‑Die (D2D) interconnects based on the UCIe standard and advanced package technologies. The role requires hands‑on ownership from architecture through silicon bring‑up, working closely with layout, verification, package, and system teams. ### Key Responsibilities Architect, design, and deliver high‑speed analog / mixed‑signal circuits for Die‑to‑Die and chiplet‑based systems, including UCIe‑compliant interfaces. Own analog blocks for high‑speed interfaces such as clocking, TX/RX front‑ends, termination schemes, biasing, and equalization support circuits. Drive architecture definition, feasibility analysis, and design trade‑offs considering signal integrity, power, noise, and packaging parasitics. Perform schematic design, simulation, and optimization across PVT corners using industry‑standard EDA tools. Work closely with advanced package teams (2.5D / 3D, interposers, organic substrates) to co‑optimize circuit and package design. Support layout reviews, parasitic extraction analysis, and post‑layout sign‑off for high‑speed performance. Collaborate with AMS verification, digital, and system teams to enable full‑chip integration and validation. Participate in silicon bring‑up, debug, and characterization, including correlation with simulation results. Contribute to design methodology, checklists, and best practices for high‑speed analog and D2D designs. ### Required Qualifications Bachelor’s or Master’s degree in Electrical / Electronics Engineering or related field. 8+ years of hands‑on experience in analog / mixed‑signal IC design. Strong experience with high‑speed interface design (e.g., DDR, PCIe, SerDes, Die‑to‑Die links). Solid understanding of UCIe standard concepts, D2D PHY requirements, and chiplet architectures. Experience working with advanced packaging technologies and understanding package‑induced effects on high‑speed signaling. Proficiency in schematic‑level design, simulation, and debug across PVT corners. Strong fundamentals in analog circuit theory, signal integrity, noise analysis, and clocking. Preferred / Nice‑to‑Have Skills Direct hands‑on experience with UCIe PHY design or integration. Exposure to AMS verification flows and mixed‑signal simulation environments. Experience with post‑silicon debug and correlation. Knowledge of power integrity, thermal considerations, and package‑aware design flows. Ability to mentor junior engineers and lead technical discussions. What Success Looks Like Robust, scalable UCIe / D2D analog IPs meeting performance, power, and reliability targets. Smooth collaboration across design, verification, and packaging teams. Predictable execution aligned with project milestones and KPIs / OKRs. Strong ownership mindset from architecture to silicon. We’re doing work that matters. Help us solve what others can’t. ## At a glance - Posted by the employer: Not stated - First seen by OpenNash: Oct 11, 2026 - Last checked: Oct 18, 2026 - Listed for: 7 days - Location: Hyderabad[Apply on Cadence Design’s careers site →](https://cadence.wd1.myworkdayjobs.com/External_Careers/job/HYDERABAD/Principal-Design-Engineer_R53736) ## More jobs at Cadence Design ### [Design Engineer II](https://jobs.opennash.com/companies/cadence-design/jobs/7f6f654f9c4f7fe714d5/) Hyderabad ### [Design engineering Architect](https://jobs.opennash.com/companies/cadence-design/jobs/563be5a022b35f0476a9/) Hyderabad ### [Lead Design Engineer](https://jobs.opennash.com/companies/cadence-design/jobs/47bd3ca844f3397408df/) Hyderabad ## Similar jobs at other companies ### [Principal VLSI Design Engineer, Datapath Design Expert](https://jobs.opennash.com/companies/sandisk/jobs/29d656d770125294c246/) Sandisk ### [Principal Mask Design Engineer](https://jobs.opennash.com/companies/sandisk/jobs/82554c377b8c4f46d335/) Sandisk ### [Principal Formal Design Verification Engineer](https://jobs.opennash.com/companies/microsoft/jobs/77157c255f58687bb52b/) Microsoft · India, Karnataka, Bangalore ### [RISCV CPU Design Verification Principal Manager/ Engineer](https://jobs.opennash.com/companies/qualcomm/jobs/312f1b332fbcaab058e8/) Qualcomm · Bangalore, India ### [Principal Engineer/Senior Staff Engineer- CPU Software & Hardware Co-Design Engineer (ML Systems)](https://jobs.opennash.com/companies/qualcomm/jobs/1fd1ae44127e47ec80dd/) Qualcomm · Bangalore, India [Design jobs](/functions/design/) OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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