[Skip to main content](#main-content) [ OpenNash ](https://opennash.com/) / [Jobs](https://jobs.opennash.com/) [ 01 Search jobs](https://jobs.opennash.com/search/)[ 02 Companies](https://jobs.opennash.com/explore/)[ 03 Hiring report](https://jobs.opennash.com/reports/hiring/)[ 04 AI assistants](https://jobs.opennash.com/connect/)[ 05 How it works](https://jobs.opennash.com/methodology/) Broadcom · USA # R&D Staff Hardware Engineer USA Full-time Senior individual contributor USD 121,900.00 To USD 195,000.00 Research & Science Listed on Broadcom’s official careers site. Posted October 21, 2026. Check that it is still open and apply there. [Apply on Broadcom’s careers site →](https://broadcom.wd1.myworkdayjobs.com/External_Career/job/USA-CA-San-Jose-Innovation-Drive/R-D-Staff-Hardware-Engineer_R027453) [OpenNash Jobs](https://jobs.opennash.com/) / [Broadcom](https://jobs.opennash.com/companies/broadcom/) / R&D Staff Hardware Engineer ## Job description ### Please Note 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. ### Job Description As a Staff Hardware Engineer, you will design, develop, and deliver Ultra High-performance electronic products. We are looking for candidates who thrive in a fast-paced, start-up-like environment and are proud of delivering high-quality products. We have a One Person One Board development culture, so you will own all aspects of EE hardware design, including BOM creation, participation with vendor negotiators, circuit/board design, development, and validation. Our Cradle to Grave lifecycle product development means ownership does not end at product ship. You will help with customer trials, field issues, and product sustaining. You will work collaboratively with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. In addition, Joint development programs may require extensive interaction with partner engineering teams. ### Key Qualifications & Experience Large high-powered SOCs based on advanced silicon and packaging process technologies, including 2D, 2.5D, and 2.5D with 3D memories. Precision Scopes, Analyzers, development & validation tools. Power and Thermal issues associated with PCBs with 1kW+ footprints High-speed & High-density signaling with SerDes rates of 112G+ Demonstrate participation in a cross-functional development team. Work with support groups, including Manufacturing, Compliance, and Safety. Bachelor's degree in electrical engineering and 8+ years of related experience Compensation and Benefits The annual base salary range for this position is USD 121,900.00 To USD 195,000.00 As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements. ### Broadcom offers a competitive and comprehensive benefits package Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence. ## At a glance - Posted by the employer: Oct 21, 2026 - First seen by OpenNash: Oct 25, 2026 - Last checked: Nov 1, 2026 - Listed for: 11 days - Location: USA - Employment type: Full-time - Pay: USD 121,900.00 To USD 195,000.00[Apply on Broadcom’s careers site →](https://broadcom.wd1.myworkdayjobs.com/External_Career/job/USA-CA-San-Jose-Innovation-Drive/R-D-Staff-Hardware-Engineer_R027453) ## Hiring at Broadcom - Open jobs: 372 - New in the last 7 days: After two weekly collections - Tracked since: Jul 10, 2026 [All Broadcom jobs](https://jobs.opennash.com/companies/broadcom/) · [Weekly hiring report](/reports/hiring/) ## More jobs at Broadcom ### [R&D Engineer](https://jobs.opennash.com/companies/broadcom/jobs/3b034af6150f037f6335/) USA ### [R&D Engineer Mechanical](https://jobs.opennash.com/companies/broadcom/jobs/97a4d4bdc29e6361090c/) USA ### [R&D Hardware Engineer](https://jobs.opennash.com/companies/broadcom/jobs/08bcaa6ccec630dd9a81/) USA ## Similar jobs at other companies ### [Staff Hardware Engineer](https://jobs.opennash.com/companies/lenovo-group/jobs/45fec0d9a2a30b173cc4/) Lenovo Group · India, Karnataka, BANGALORE ### [Staff Engineer Hardware Probe Technology](https://jobs.opennash.com/companies/infineon-technologies/jobs/941cd7608ec933aa8eff/) Infineon Technologies · Penang ### [Staff Hardware Engineer](https://jobs.opennash.com/companies/infineon-technologies/jobs/c4cfa4d40c6b5a1ef728/) Infineon Technologies · Xi'an, 西安 ### [Hardware Design Engineer – Application Engineering, Staff](https://jobs.opennash.com/companies/qualcomm/jobs/f5e23b5b2d1c68460bb5/) Qualcomm · Ottawa, Ontario, Canada OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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