[Skip to main content](#main-content) [ OpenNash ](https://opennash.com/) / [Jobs](https://jobs.opennash.com/) [ 01 Search jobs](https://jobs.opennash.com/search/)[ 02 Companies](https://jobs.opennash.com/explore/)[ 03 Hiring report](https://jobs.opennash.com/reports/hiring/)[ 04 AI assistants](https://jobs.opennash.com/connect/)[ 05 How it works](https://jobs.opennash.com/methodology/) Broadcom # Substrate Engineer Full-time Operations Listed on Broadcom’s official careers site. Posted October 20, 2026. Check that it is still open and apply there. [Apply on Broadcom’s careers site →](https://broadcom.wd1.myworkdayjobs.com/External_Career/job/Taiwan-Hsinchu-Puding-Road/Substrate-Engineer_R027339) [OpenNash Jobs](https://jobs.opennash.com/) / [Broadcom](https://jobs.opennash.com/companies/broadcom/) / Substrate Engineer ## Job description ### Please Note 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. ### Job Description Responsible for working with Broadcom substrate subcontractors to manage and resolve issue relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices. Responsible for NPI activities, risk assessment, process improvement and development and production engineering support of high volume IC substrate manufacturing. Wok with Broadcom internal cross functional engineering team resolves issues with interactive nature, work on newly developed packaging technology and drive towards high volume manufacturing maturity. Responsible for new product pre-production engineering activities and drive improvement in process and visual mechanical yields, cycle time\ Take on site standardization in Best Known Methods, and verification on compliance toward Broadcom requirement. Drive capability enhancement and cost reduction projects Qualification of new substrate suppliers and support for moving to HVM Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence. ## At a glance - Posted by the employer: Oct 20, 2026 - First seen by OpenNash: Oct 25, 2026 - Last checked: Nov 1, 2026 - Listed for: 12 days - Employment type: Full-time[Apply on Broadcom’s careers site →](https://broadcom.wd1.myworkdayjobs.com/External_Career/job/Taiwan-Hsinchu-Puding-Road/Substrate-Engineer_R027339) ## Hiring at Broadcom - Open jobs: 372 - New in the last 7 days: After two weekly collections - Tracked since: Jul 10, 2026 [All Broadcom jobs](https://jobs.opennash.com/companies/broadcom/) · [Weekly hiring report](/reports/hiring/) ## More jobs at Broadcom ### [AI Systems Performance Engineer](https://jobs.opennash.com/companies/broadcom/jobs/8155e91055eeffd5fad4/) USA ### [ASIC Implementation Engineer PD](https://jobs.opennash.com/companies/broadcom/jobs/c82e47f8dd4088937ae1/) USA ### [Asic Verification Engineer](https://jobs.opennash.com/companies/broadcom/jobs/a2f6818b2edbb28f05c5/) ### [ASIC Verification Engineer](https://jobs.opennash.com/companies/broadcom/jobs/b87c6fac9d8ea6d3eb14/) ### [ASIC Verification Engineer](https://jobs.opennash.com/companies/broadcom/jobs/92e44144339bd96fa81e/) Pune EON Kharadi Infrastructure, IND ## Similar jobs at other companies ### [Senior Staff Engineer Substrate Designer](https://jobs.opennash.com/companies/infineon-technologies/jobs/d59d744eb67323e30300/) Infineon Technologies · Melaka ### [Packaging Engineer (Substrate Design and Layout)](https://jobs.opennash.com/companies/sandisk/jobs/0879670410f04691dc62/) Sandisk ### [IC Packaging Substrate Engineer, up to Staff](https://jobs.opennash.com/companies/qualcomm/jobs/519d932b1396f43e061a/) Qualcomm · Hsinchu City, Taiwan ### [Packaging Engineer (Substrate Design and Layout, Only open for fresh graduate)](https://jobs.opennash.com/companies/sandisk/jobs/735351022b0a02b8dbda/) Sandisk ### [Industrial Trainee - Substrate and Defect Engineering](https://jobs.opennash.com/companies/infineon-technologies/jobs/577dc897c6356558f44b/) Infineon Technologies · Kulim OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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