[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All Broadcom jobs](https://jobs.opennash.com/companies/broadcom/) · [Search jobs](/search/) Broadcom · USA # Staff Program Manager - Advanced Packaging Technology USA Full-time Manager or lead $109,700 - $175,500 Listed on Broadcom’s official careers site. Listed as of October 18, 2026. Check that it is still open and apply there. [Apply on Broadcom’s careers site →](https://broadcom.wd1.myworkdayjobs.com/External_Career/job/USA-CA-Irvine-Alton-Parkway-Bldg-2/Staff-Program-Manager---Advanced-Packaging-Technology_R026235) [OpenNash Jobs](https://jobs.opennash.com/) / [Broadcom](https://jobs.opennash.com/companies/broadcom/) / Staff Program Manager - Advanced Packaging Technology ## Job description ### Please Note 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. ### Job Description Staff Program Manager – Advanced Packaging Technology Overview The Staff Program Manager will manage one or more very large scale Advanced Packaging manufacturing projects, through the entire lifecycle from greenfield factory construction, to tool procurement, and all the way to production ramp. Extensive collaboration is required with all stakeholders (R&D and Factory Teams, internal Project Team members & executives, Partners, EPC Contractor and Tool Vendors worldwide) to achieve all project milestones on schedule and within budget, with proven yield and quality in production ### Key Responsibilities Technology Development and Transfer for Production - Achieve on time Technology Qualification, through collaborate with in-house and partner R&D teams developing disruptive technologies. - Facilitate successful Technology Transfer from R&D into High Volume Manufacturing (HVM) Factory Construction - Coordinate greenfield construction of a very large scale advanced packaging manufacturing facility - Manage the EPC contractor and other local architectural, engineering, and sub- contractor firms to ensure strict timeline and safety compliance. - Oversee compliance with local codes / requirements for land development, civil engineering, cleanroom construction, and facility hook-up. - Report program status, budget variances, and milestone achievements directly to executive leadership. ### Tool Procurement & Integration - Work with Factory and R&D Teams on Tool selection, procurement, logistics, and installation of next generation equipment for Heterogeneous Integration from global tier-one vendors - Coordinate complex international logistics to import highly sensitive tooling and materials - Oversee the hook-up, facility integration, and initial hardware qualification of all manufacturing lines. ### Production Ramp & Yield Optimization - Partner with Factory & R&D teams and Tool vendors, for operational transition from tool qualification to HVM readiness - Accelerate yield learning curves and meet target defect-density metrics in collaboration with process engineering and quality teams - Manage manufacturing cycle time, line balancing, and factory automation deployment during the ramp phase. - Establish standard operating procedures (SOPs) and training pipelines to upscale the local workforce for stable production. ### Financial & Local Regulatory Compliance - Manage multi-billion-dollar CapEx and OpEx budgets and cash flows, in collaboration with Finance teams. - Ensure compliance with local Regulatory Agency requirements - Implement strict risk-mitigation frameworks to handle supply chain bottlenecks and labor market constraints. ### Education - Master’s degree in Engineering, Materials Science, or related STEM field. MBA preferred. ### Experience - 6+ years managing very large projects, with explicit experience in greenfield factory construction and factory ramps. ### Domain - Deep technical understanding of advanced packaging and semiconductor manufacturing technologies (Heterogeneous Integration, Substrates, Co-packaged Optics). ### Ramp Expertise - Proven track record transitioning a semiconductor facility from construction to high-volume production. ### Geography - Foundational knowledge of delivering large-scale offshore industrial projects Skills & Certifications ### Certifications - PMP, PgMP, or equivalent senior-level project management credentials. ### Operations - Strong grasp of factory physics, statistical process control (SPC), yield management, and Lean manufacturing. ### Supply Chain - Expertise in managing global semiconductor tool and material vendors. ### Software - Advanced mastery of enterprise scheduling tools (e.g., Primavera P6, MS Project). ### Soft Skills - Exceptional stakeholder management skills for navigating dynamically changing business and product requirements Additional Job Description: Compensation and Benefits The annual base salary range for this position is $109,700 - $175,500 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence. ## At a glance - Posted by the employer: Not stated - First seen by OpenNash: Jul 10, 2026 - Last checked: Oct 18, 2026 - Listed for: 100 days - Location: USA - Employment type: Full-time - Pay: $109,700 - $175,500[Apply on Broadcom’s careers site →](https://broadcom.wd1.myworkdayjobs.com/External_Career/job/USA-CA-Irvine-Alton-Parkway-Bldg-2/Staff-Program-Manager---Advanced-Packaging-Technology_R026235) ## More jobs at Broadcom ### [DSP System Architect](https://jobs.opennash.com/companies/broadcom/jobs/cd9bd5589776451377a1/) USA ### [ASIC Verification Engineer](https://jobs.opennash.com/companies/broadcom/jobs/18eb6f8fd75df0d4bbd3/) USA ### [Analog Layout Designer](https://jobs.opennash.com/companies/broadcom/jobs/f066f490f29ec6b636d8/) USA ### [Mfg Technician Proc/Prod](https://jobs.opennash.com/companies/broadcom/jobs/330e77fc91ab49d5bd55/) USA ### [R&D Engineer Hardware](https://jobs.opennash.com/companies/broadcom/jobs/30bf10015213ecf878ae/) USA ## Similar jobs at other companies ### [Process Engineer 5 (Advanced Packaging Integration Technologist)](https://jobs.opennash.com/companies/lam-research/jobs/23214597426c8f31b821/) Lam Research · Tualatin, OR, US ### [Senior Staff Packaging Engineering](https://jobs.opennash.com/companies/sandisk/jobs/be3b16b543796060debe/) Sandisk ### [Staff Engineer, Packaging Engineering, Structural Simulation](https://jobs.opennash.com/companies/sandisk/jobs/d1616f44d616ed793994/) Sandisk ### [Packaging Technology Integration, Senior Staff Engineer](https://jobs.opennash.com/companies/qualcomm/jobs/dc3654c942cb55f78aaa/) Qualcomm · Singapore, Central Singapore ### [SMTS Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)](https://jobs.opennash.com/companies/globalfoundries/jobs/93e5cba2e549d71b5b8a/) GlobalFoundries · Singapore OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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