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BOE Technology Group · 北京市

# 【创新业务】硬件系统设计研究员（北京）

北京市 

Listed on BOE Technology Group’s official careers site. Listed as of October 30, 2026. Check that it is still open and apply there.

[OpenNash Jobs](https://jobs.opennash.com/) / [BOE Technology Group](https://jobs.opennash.com/companies/boe-technology-group/) / 【创新业务】硬件系统设计研究员（北京）

## Job description

岗位职责
- 负责硅基Micro OLED整机驱动硬件、驱动板卡、测试工装、芯片验证硬件系统的原理图设计、电路板布局开发，输出完整硬件设计文件；
- 完成硬件器件选型、BOM编制、电源系统、信号完整性、EMC基础设计分析，保障硬件系统稳定匹配微显示芯片工作特性；
- 主导硬件样板焊接、上电调试、性能测试，定位电源、高速信号、接口、稳定性等硬件故障，输出整改优化方案；
- 协同后端、工艺、测试团队，搭建Micro OLED芯片全套测试硬件平台，完成芯片电学性能、光学显示性能的硬件测试环境搭建；
- 其他领导安排的相关工作。 任职要求 1、硕士应届毕业生； 2、电子信息工程、电子科学、集成电路、测控技术、自动化等硬件相关专业; 3、①熟练使用至少一款电路设计软件，能够独立完成原理图绘制、电路板布局； ②精通模电、数电基础，熟悉DC-DC/LDO电源电路、常见通信接口、模拟采集电路设计原理； ③具备硬件调试基础，会使用示波器、万用表、直流电源等基础测试仪器，有硬件设计相关项目、毕设经验优先； 4、①具备基础英文资料查阅能力，逻辑清晰，耐心细致； ②思路清晰，逻辑思维、沟通表达能力强； ③正直、诚信、有激情、专注、具备良好的团队精神； 5、有较好的英语综合能力及英文文献自主阅读能力（CET6/雅思6/托 福80及以上）。

## At a glance
- Posted by the employer: Not stated
- First seen by OpenNash: Oct 30, 2026
- Last checked: Oct 30, 2026
- Listed for: Under a day
- Location: 北京市

## Hiring at BOE Technology Group
- Open jobs: 1,004
- New in the last 7 days: After two weekly collections
- Tracked since: Oct 30, 2026

[All BOE Technology Group jobs](https://jobs.opennash.com/companies/boe-technology-group/) · [Weekly hiring report](/reports/hiring/)

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