[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All Applied Materials jobs](https://jobs.opennash.com/companies/applied-materials/) · [Search jobs](/search/) Applied Materials · Singapore, SGP # Technology Development Engineer – Hybrid Bonding & Advanced Packaging (Internship) Singapore, SGP Hybrid Early career Operations Listed on Applied Materials’s official careers site. Posted October 6, 2026. Check that it is still open and apply there. [Apply on Applied Materials’s careers site →](https://amat.wd1.myworkdayjobs.com/External/job/SingaporeSGP/Technology-Development-Engineer---Hybrid-Bonding---Advanced-Packaging--Internship-_R2626900) [OpenNash Jobs](https://jobs.opennash.com/) / [Applied Materials](https://jobs.opennash.com/companies/applied-materials/) / Technology Development Engineer – Hybrid Bonding & Advanced Packaging (Internship) ## Job description ### Who We Are Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. ### What We Offer Location: Singapore,SGP You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. Advanced packaging technologies are critical enablers for continued semiconductor performance scaling beyond traditional node shrink. This internship project will focus on the development and integration of key advanced packaging building blocks, including redistribution layers (RDL), damascene copper structures, wafer-level interconnects, and hybrid bonding processes. The intern will support the Process Integration team in developing and characterizing test vehicles used for chip-to-wafer and wafer-to-wafer hybrid bonding applications. Responsibilities include process flow development, experimental design, data analysis, defect characterization, and correlation of process parameters to electrical and physical performance metrics. The intern will gain hands-on exposure to semiconductor fabrication processes, advanced packaging integration challenges, statistical data analysis, and engineering problem-solving methodologies. By the end of the internship, the candidate is expected to develop a solid understanding of advanced packaging technology, process integration principles, and engineering best practices while contributing to ongoing R&D projects supporting next-generation semiconductor packaging solutions. ### Additional Information Time Type Full time Employee Type: Intern / Student Travel: No Relocation Eligible: No Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law. ## At a glance - Posted by the employer: Oct 6, 2026 - First seen by OpenNash: Oct 11, 2026 - Last checked: Oct 18, 2026 - Listed for: 12 days - Location: Singapore, SGP - Work arrangement: Hybrid[Apply on Applied Materials’s careers site →](https://amat.wd1.myworkdayjobs.com/External/job/SingaporeSGP/Technology-Development-Engineer---Hybrid-Bonding---Advanced-Packaging--Internship-_R2626900) ## More jobs at Applied Materials ### [AI Engineer](https://jobs.opennash.com/companies/applied-materials/jobs/f84e4b9076a172e461be/) Singapore, SGP ### [AIX Field Service Engineer](https://jobs.opennash.com/companies/applied-materials/jobs/3d09ba677570d93d2661/) Singapore, SGP ### [Abatement Systems Engineer](https://jobs.opennash.com/companies/applied-materials/jobs/4c5b99021283db1631af/) Singapore, SGP ### [Application Engineer](https://jobs.opennash.com/companies/applied-materials/jobs/b3f1578705aa53b8860c/) Singapore, SGP ## Similar jobs at other companies ### [Technology Development Engineer, Memory Technology](https://jobs.opennash.com/companies/sandisk/jobs/bcd74564ad4866aaa139/) Sandisk ### [Senior Technology Development Engineer • Memory Technology](https://jobs.opennash.com/companies/sandisk/jobs/63475d700420ca65172f/) Sandisk ### [Senior Engineer Technology Development (f/m/div)](https://jobs.opennash.com/companies/infineon-technologies/jobs/a0ffb851d0bc843e7c7f/) Infineon Technologies · Villach ### [Staff / Senior Staff Engineer Package Technology Development](https://jobs.opennash.com/companies/infineon-technologies/jobs/9b374c522f68802aeea1/) Infineon Technologies · Singapore ### [Senior Development Engineer – Rates Risk Technology (VP)](https://jobs.opennash.com/companies/citigroup/jobs/1524ef98190539b5ecb7/) Citigroup · London United Kingdom OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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