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Apple

# IC Package Design Engineer

San Francisco Bay Area, United States of America Design 

Listed on Apple’s official careers site. Posted September 22, 2026. Check that it is still open and apply there.
[Apply on Apple’s careers site →](https://jobs.apple.com/en-us/details/200684933/ic-package-design-engineer)

[OpenNash Jobs](https://jobs.opennash.com/) / [Apple](https://jobs.opennash.com/companies/apple/) / IC Package Design Engineer

## Job description

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for Apple’s internal and custom components across products including iPhone, iPad, Mac, Apple Watch, and Apple TV. We’re looking for a Package Design Engineer to drive the physical design and integration of advanced semiconductor packages across SoC, memory, RF, and cellular technologies. You will play a key role in shaping the architecture, scalability, and efficiency of next-generation products while advancing design methodologies through automation and AI.

## At a glance
- Posted by the employer: Sep 22, 2026
- First seen by OpenNash: Oct 11, 2026
- Last checked: Oct 18, 2026
- Listed for: 26 days
- Location: San Francisco Bay Area, United States of America[Apply on Apple’s careers site →](https://jobs.apple.com/en-us/details/200684933/ic-package-design-engineer)

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OpenNash lists jobs from employers’ own careers sites and does not handle applications.
Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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