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Apple · Seoul, Korea, Republic of

# Packaging Assembly Engineer

Seoul, Korea, Republic of Manufacturing & Production 

Listed on Apple’s official careers site. Posted April 30, 2026. Check that it is still open and apply there.
[Apply on Apple’s careers site →](https://jobs.apple.com/en-us/details/200660418/packaging-assembly-engineer)

[OpenNash Jobs](https://jobs.opennash.com/) / [Apple](https://jobs.opennash.com/companies/apple/) / Packaging Assembly Engineer

## Job description

Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.

## At a glance
- Posted by the employer: Apr 30, 2026
- First seen by OpenNash: Jul 10, 2026
- Last checked: Oct 18, 2026
- Listed for: 171 days
- Location: Seoul, Korea, Republic of[Apply on Apple’s careers site →](https://jobs.apple.com/en-us/details/200660418/packaging-assembly-engineer)

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Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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