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Apple

# Packaging Substrate Engineer

San Francisco Bay Area, United States of America Operations 

Listed on Apple’s official careers site. Posted October 26, 2026. Check that it is still open and apply there.
[Apply on Apple’s careers site →](https://jobs.apple.com/en-us/details/200691323/packaging-substrate-engineer)

[OpenNash Jobs](https://jobs.opennash.com/) / [Apple](https://jobs.opennash.com/companies/apple/) / Packaging Substrate Engineer

## Job description

Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance.

## At a glance
- Posted by the employer: Oct 26, 2026
- First seen by OpenNash: Nov 1, 2026
- Last checked: Nov 1, 2026
- Listed for: 6 days
- Location: San Francisco Bay Area, United States of America[Apply on Apple’s careers site →](https://jobs.apple.com/en-us/details/200691323/packaging-substrate-engineer)

## Hiring at Apple
- Open jobs: 6,319
- New in the last 7 days: After two weekly collections
- Tracked since: Jul 10, 2026

[All Apple jobs](https://jobs.opennash.com/companies/apple/) · [Weekly hiring report](/reports/hiring/)

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Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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