[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All Amazon jobs](https://jobs.opennash.com/companies/amazon/) · [Search jobs](/search/) Amazon · San Diego, CA # IC Packaging Design Engineer, Amazon Leo US, CA, San Diego Design Listed on Amazon’s official careers site. Posted September 8, 2026. Check that it is still open and apply there. [Apply on Amazon’s careers site →](https://www.amazon.jobs/en/jobs/10532104/ic-packaging-design-engineer-amazon-leo) [OpenNash Jobs](https://jobs.opennash.com/) / [Amazon](https://jobs.opennash.com/companies/amazon/) / IC Packaging Design Engineer, Amazon Leo ## Job description Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world. Come work at Amazon! ### The Role As an IC Packaging Design Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions. You will work closely with an internal inter-disciplinary team, and third-party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment. As a member of the packaging team, you will be responsible for package design for mm-wave beamforming SoCs and front-end modules. Strong focus will be on creating the most power optimized solution for a given system performance. ### Export Control Requirement Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum. Key job responsibilities In this role you will: - Collaborate with digital design, and RF chip designers define floorplans, bump maps, and ball maps for beamforming ICs. - Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design. - Analyze cost/performance trade-offs, and complete layout of package types such as FCBGA, FCCSP, WLCSP, QFN, etc. - Setup and run 3D electromagnetic simulations of package + PCB in tools such as HFSS and Momentum to verify your designs. - Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling. - Assist the thermal team in defining and running thermal simulations of packages and PCBs. - Collaborate with the Antenna and EE teams to design and layout test and application PCBs for your packages. ### Advise on qualification of packages - HAST, HTOL, board level reliability, etc. - Define and implement AI-driven workflows for packaging design, leveraging automation and machine learning to accelerate design iterations and optimize performance. ## At a glance - Posted by the employer: Sep 8, 2026 - First seen by OpenNash: Oct 11, 2026 - Last checked: Oct 11, 2026 - Listed for: 33 days - Location: US, CA, San Diego[Apply on Amazon’s careers site →](https://www.amazon.jobs/en/jobs/10532104/ic-packaging-design-engineer-amazon-leo) ## More jobs at Amazon ### [ASIC Design Engineer, Satellite Communication](https://jobs.opennash.com/companies/amazon/jobs/09c8c54fbd6dc5368cc0/) US, CA, San Diego ### [ASIC Design Verification Engineer, Amazon Leo](https://jobs.opennash.com/companies/amazon/jobs/d281fbe5b6515f4c615c/) US, CA, San Diego ### [ASIC Engineer - RF/DSP Systems Design, LEO](https://jobs.opennash.com/companies/amazon/jobs/71daf26c977e20829dbc/) US, CA, San Diego ### [Design Verification Tech Lead Engineer, Amazon Leo](https://jobs.opennash.com/companies/amazon/jobs/0ac513e6d66b8454a33e/) US, CA, San Diego ### [RFIC Design Engineer, Amazon Leo](https://jobs.opennash.com/companies/amazon/jobs/194a723809629a112149/) US, CA, San Diego ## Similar jobs at other companies ### [Microelectronic Packaging Design Engineer](https://jobs.opennash.com/companies/sanmina-sci/jobs/b63064048b555f01a98a/) Sanmina-SCI · Ottawa, ON, CA ### [Project Engineer - Mechanical Packaging Design](https://jobs.opennash.com/companies/abb/jobs/859a63380d10fca698a6/) ABB · Fort Smith, Arkansas, United States of America ### [Senior Packaging Design Engineer - St. Louis, MO](https://jobs.opennash.com/companies/hubbell/jobs/03f9430cba74acb6f65c/) Hubbell · St. Louis, MO, US ### [Packaging Engineer](https://jobs.opennash.com/companies/lockheed-martin/jobs/f38ca6ceee0f57f954b3/) Lockheed Martin · Orlando, FL ### [Packaging Engineer](https://jobs.opennash.com/companies/lockheed-martin/jobs/1d0d0b3f409418a14512/) Lockheed Martin · Grand Prairie, TX [Jobs in San Diego, CA](/locations/us/ca/san-diego/)[Jobs in California](/locations/us-ca/)[Design jobs](/functions/design/) OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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