[Skip to main content](#main-content) [ OpenNash ](https://opennash.com/) / [Jobs](https://jobs.opennash.com/) [ 01 Search jobs](https://jobs.opennash.com/search/)[ 02 Companies](https://jobs.opennash.com/explore/)[ 03 Hiring report](https://jobs.opennash.com/reports/hiring/)[ 04 AI assistants](https://jobs.opennash.com/connect/)[ 05 How it works](https://jobs.opennash.com/methodology/) Amazon · Austin, TX # Package Engineer, Annapurna Labs - AI Silicon Packaging US, TX, Austin Operations Listed on Amazon’s official careers site. Posted October 22, 2026. Check that it is still open and apply there. [Apply on Amazon’s careers site →](https://www.amazon.jobs/en/jobs/10586331/package-engineer-annapurna-labs-ai-silicon-packaging) [OpenNash Jobs](https://jobs.opennash.com/) / [Amazon](https://jobs.opennash.com/companies/amazon/) / Package Engineer, Annapurna Labs - AI Silicon Packaging ## Job description Annapurna Labs designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world. The Package Technology Development team within Annapurna Labs is building the packaging, substrate/PCB, interposer, and assembly technologies for the next-generation Trainium AI accelerators. The team works at the intersection of silicon, package, board, system, and rack, partnering closely with design, manufacturing, supply chain, and reliability teams to bring bleeding-edge AI systems from concept to volume production. ### Key job responsibilities - Define and drive package technology development across architecture, design, materials, processes, yield, warpage, reliability, and system-level integration for next-generation Trainium systems, from early concept through volume production. - Partner with OSATs and component/material/equipment suppliers on capability validation, test vehicle development, qualification, TGA, FMEA, risk retirement, root-cause analysis, and corrective/preventive actions - Evaluate tradeoffs across performance, cost, yield, manufacturability, warpage, thermal performance, and reliability to guide technology decisions and qualification strategies. - Represent the package technology team in cross-functional design reviews, sign-off milestones, and program checkpoints with silicon, board, system, and supply chain teams. - Identify opportunities for novel packaging architectures and process simplifications to reduce cost, improve yield, and accelerate time-to-market. ## At a glance - Posted by the employer: Oct 22, 2026 - First seen by OpenNash: Oct 25, 2026 - Last checked: Nov 1, 2026 - Listed for: 10 days - Location: US, TX, Austin[Apply on Amazon’s careers site →](https://www.amazon.jobs/en/jobs/10586331/package-engineer-annapurna-labs-ai-silicon-packaging) ## Hiring at Amazon - Open jobs: 19,174 - New in the last 7 days: After two weekly collections - Tracked since: Jul 10, 2026 [All Amazon jobs](https://jobs.opennash.com/companies/amazon/) · [Weekly hiring report](/reports/hiring/) ## More jobs at Amazon ### [ASIC Formal Verification Engineer I, Annapurna Labs](https://jobs.opennash.com/companies/amazon/jobs/be03c79c9e0d067c5566/) US, TX, Austin ### [ASIC Test Engineer, Annapurna Silicon Operations](https://jobs.opennash.com/companies/amazon/jobs/f4cb6a4c3176cd983a4c/) US, TX, Austin ### [Automation Engineer, Prime Video Trust & Safety](https://jobs.opennash.com/companies/amazon/jobs/253da092f7a76af63ea9/) US, TX, Austin ### [B2B Content Creator, Ring Business](https://jobs.opennash.com/companies/amazon/jobs/518af988f6fd13062f09/) US, TX, Austin ### [Cellular Systems Engineering Lead, Direct-to-Device, Amazon Leo](https://jobs.opennash.com/companies/amazon/jobs/7340fe5f4f1368e3b04e/) US, TX, Austin ## Similar jobs at other companies ### [FAST Labs - Systems Engineer - All Levels](https://jobs.opennash.com/companies/bae-systems/jobs/2308c46a37b8276203ff/) BAE Systems · Merrimack, New Hampshire, United States ### [FAST Labs - Systems Engineer - Early Career Levels](https://jobs.opennash.com/companies/bae-systems/jobs/53d60715dca71c2ccc37/) BAE Systems · Merrimack, New Hampshire, United States ### [Principal Software Engineer – Oracle Labs & Experiences (Oracle Labs)](https://jobs.opennash.com/companies/oracle/jobs/3f2a6824f32cd73d7bcf/) Oracle · United States ### [Package Design Engineer - Staff](https://jobs.opennash.com/companies/qualcomm/jobs/0f92ad829e5462a761ac/) Qualcomm · San Diego, California, United States of America OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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