[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All Alphabet jobs](https://jobs.opennash.com/companies/alphabet/) · [Search jobs](/search/) Alphabet · Goleta, CA # Fabrication Backend Process Engineer, Quantum AI Goleta, CA, USA Software Engineering Listed on Alphabet’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there. [Apply on Alphabet’s careers site →](https://www.google.com/about/careers/applications/jobs/results/85388351703524038-fabrication-backend-process-engineer-quantum-ai) [OpenNash Jobs](https://jobs.opennash.com/) / [Alphabet](https://jobs.opennash.com/companies/alphabet/) / Fabrication Backend Process Engineer, Quantum AI ## Job description ### Minimum qualifications Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience. 1 year of experience in a wafer level or die level cleanroom environment. 1 year of experience with one or more of the following: SPC (statistical process control), Electrical test (Probing), Metrologies (SEM, XPS, Interferometry), or Failure analysis. 1 year of experience in hybridization techniques, including flip chip bonding, die handling and post bonding measurement. ### Preferred qualifications Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP). Experience with developing novel bump materials, scaling up die sizes, flip-chip bonding or designing structural bonding solutions. Experience with characterization techniques including SEM, XPS, confocal microscopy, and interferometry. Experience with statistical process control and failure analysis activities. Experience with data analysis and visualization tools such as JMP, Python, or SQL. About the job As a Fabrication Backend Process Engineer, you will play a role in the development and manufacturing of our quantum processor devices. You will be responsible for the die singulation process, die cleaning process, hybridization process, and device characterization modules. Your expertise will be crucial in developing scalable bonding processes and die preparation processes that meet the quality standards. You will collaborate closely with cross-functional teams, including design, test, integration and front-end engineers, to optimize device performance, yield, and reliability. Additionally, you will play a key role in the qualification of equipment and processes to establish and maintain an advanced packaging technique.The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.Individual pay is determined by factors including job-related skills, experience, and relevant education or training. ### US $108000 - $153000 (USD) + 15% bonus target + equity + benefits Learn more about benefits at Google. ## At a glance - Posted by the employer: Not stated - First seen by OpenNash: Oct 13, 2026 - Last checked: Oct 23, 2026 - Listed for: 10 days - Location: Goleta, CA, USA[Apply on Alphabet’s careers site →](https://www.google.com/about/careers/applications/jobs/results/85388351703524038-fabrication-backend-process-engineer-quantum-ai) ## More jobs at Alphabet ### [Advanced Packaging Development Engineer, Quantum AI](https://jobs.opennash.com/companies/alphabet/jobs/cb3fe7c365f3544e290f/) Goleta, CA, USA ### [Electromagnetic Engineer, Superconducting Qubit Package Modeling, Quantum AI](https://jobs.opennash.com/companies/alphabet/jobs/6dd29f56f7aa5b8b6526/) Goleta, CA, USA ### [AI Data Developer I, Professional Services, Google Cloud](https://jobs.opennash.com/companies/alphabet/jobs/56d43e5cd8ba08e5881f/) Toronto, ON, Canada ### [AI Data Developer II, Professional Services, Google Cloud](https://jobs.opennash.com/companies/alphabet/jobs/cfb705a073f4baa0c66c/) Toronto, ON, Canada ### [AI Outcome Customer Developer, Forward Deployed Development](https://jobs.opennash.com/companies/alphabet/jobs/bcbf5af034e29d32260c/) Toronto, ON, Canada ## Similar jobs at other companies ### [Enterprise Fabrication Industrial Engineer Staff - Level 4](https://jobs.opennash.com/companies/lockheed-martin/jobs/f631cbda9974e2a72483/) Lockheed Martin · Fort Worth, TX ### [Senior Process Engineer – Optical Fabrication](https://jobs.opennash.com/companies/asml-holding/jobs/d1fd9e9c5543a3f2591c/) ASML Holding · Wilton, CT, USA ### [Software Engineer III - Backend Data Engineer](https://jobs.opennash.com/companies/jpmorganchase/jobs/4885c61c7b928c3d1cb8/) JPMorganChase · Plano, TX, United States ### [Supplier Development Engineer - Fabrication](https://jobs.opennash.com/companies/eaton/jobs/0916d4bf29fb44be84bd/) Eaton · Charlotte, North Carolina, USA, Raleigh ### [Lead Software Engineer - Java Backend Engineer](https://jobs.opennash.com/companies/jpmorganchase/jobs/700c9d827e5cde1b2302/) JPMorganChase · Jersey City, NJ, United States OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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