[Skip to main content](#main-content) [ OpenNash ](https://opennash.com/) / [Jobs](https://jobs.opennash.com/) [ 01 Search jobs](https://jobs.opennash.com/search/)[ 02 Companies](https://jobs.opennash.com/explore/)[ 03 Hiring report](https://jobs.opennash.com/reports/hiring/)[ 04 AI assistants](https://jobs.opennash.com/connect/)[ 05 How it works](https://jobs.opennash.com/methodology/) Advanced Micro Devices (AMD) · Hsinchu, Taiwan # Packaging Engineer Hsinchu, Taiwan Full-time Operations Listed on Advanced Micro Devices (AMD)’s official careers site. Posted October 28, 2026. Check that it is still open and apply there. [Apply on Advanced Micro Devices (AMD)’s careers site →](https://global-external-amd.icims.com/jobs/94422/login) [OpenNash Jobs](https://jobs.opennash.com/) / [Advanced Micro Devices (AMD)](https://jobs.opennash.com/companies/advanced-micro-devices-amd/) / Packaging Engineer ## Job description ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career. ### THE ROLE Main role is to lead assembly technology development with OSAT and foundry partners. In parallel this individual is also expected to drive technology development across the industry to meet future requirements. ### THE PERSON This individual should be self-motivated and is able to work independently with minimal supervision. Excellent communication skills to collaborate with both internal and external partners. Established relationship with industry partners in the field of advanced assembly technology specifically in large module on substrate assembly. ### KEY RESPONSIBILITIES Drive OSAT to develop advanced assembly technology capabilities to meet technology development deliverables. Collaborate with integration and design teams to integrate assembly and design needs. Formulate plans to enhance assembly capabilities to meet design needs. Establish ecosystem partners to identify assembly capability improvement roadmap PREFERRED EXPERIENCE: Demonstrated leadership skills in managing OSATs and teams with various backgrounds In depth process knowledge of key assembly processes: die prep, various die bond methods, underfill, lid attach etc.. Hands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience. Well verse in typical technology development tools, FMEA, SPC, control plans, etc.. Ability to communicate well in both English and Chinese language ACADEMIC CREDENTIALS: Minimum Msc, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or equivalent. ### LOCATION Hsinchu / Kaohsiung Taiwan #LI-IH1 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy. ## At a glance - Posted by the employer: Oct 28, 2026 - First seen by OpenNash: Nov 1, 2026 - Last checked: Nov 1, 2026 - Listed for: 4 days - Location: Hsinchu, Taiwan - Employment type: Full-time[Apply on Advanced Micro Devices (AMD)’s careers site →](https://global-external-amd.icims.com/jobs/94422/login) ## Hiring at Advanced Micro Devices (AMD) - Open jobs: 1,273 - New in the last 7 days: After two weekly collections - Tracked since: Jul 10, 2026 [All Advanced Micro Devices (AMD) jobs](https://jobs.opennash.com/companies/advanced-micro-devices-amd/) · [Weekly hiring report](/reports/hiring/) ## More jobs at Advanced Micro Devices (AMD) ### [Manager Industrial Engineering](https://jobs.opennash.com/companies/advanced-micro-devices-amd/jobs/9febf7d8183a453b62a8/) Hsinchu, Taiwan ### [Manager, Product Engineering](https://jobs.opennash.com/companies/advanced-micro-devices-amd/jobs/e38b63fd2b1c8b2e5879/) Hsinchu, Taiwan ### [OSAT Execution Program Manager](https://jobs.opennash.com/companies/advanced-micro-devices-amd/jobs/36179544b5f6c7755c15/) Hsinchu, Taiwan ## Similar jobs at other companies ### [Engineer, Packaging Engineering](https://jobs.opennash.com/companies/sandisk/jobs/ede917ca8fd0fe48d75c/) Sandisk ### [Senior Packaging Engineer](https://jobs.opennash.com/companies/sandisk/jobs/6f2c2469fad38de10b49/) Sandisk ### [Senior Packaging Engineer](https://jobs.opennash.com/companies/microsoft/jobs/6e243837e33c4a8e2eb5/) Microsoft · Malaysia, Pulau Pinang, Gelugor ### [Senior/Principal Optical Packaging Engineer](https://jobs.opennash.com/companies/microsoft/jobs/eaf80b73bf6230089158/) Microsoft · United Kingdom, Cambridgeshire, Cambridge ### [Technical Marketing Engineer Advanced IC Packaging](https://jobs.opennash.com/companies/siemens/jobs/9f69484ee664ca1b072c/) Siemens OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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